- Tech News & Insight
- January 23, 2025
- Amit Mohite
Discover how semiconductor packaging is transforming technology, driving advancements in AI, 5G, IoT, and autonomous vehicles. This in-depth analysis explores cutting-edge technologies like System-in-Package (SiP), 3D ICs, and chiplet design, highlighting their transformative impact on device performance, energy efficiency, and miniaturization. From AI accelerators to sustainable packaging solutions, explore the trends, challenges, and future opportunities shaping the semiconductor industry's next wave of innovation.