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The Capital Behind the Compute: Digital Infrastructure Insights, August 2026

The Capital Behind the Compute: Digital Infrastructure Insights, August 2026
August 2026's roundup: Nvidia forms $500B+ AI compute financing platforms with the world's largest asset managers, SK Telecom's SK Hyper data centre unit and Microsoft's new Hyderabad hyperscale region both go live, the custom silicon race widens to include OpenAI's own inference chip and a reported $12.9B Nvidia bid for Hugging Face, and SpaceX's infrastructure ambitions extend from a $16.8B Texas fab to orbital data centers.

Chip Manufacturing Capital Hits Record Scale as SK hynix Debuts on Nasdaq: Digital Infrastructure Insights, July 2026

Chip Manufacturing Capital Hits Record Scale as SK hynix Debuts on Nasdaq: Digital Infrastructure Insights, July 2026
July 2026's roundup: TSMC raises its Arizona commitment to $265 billion, Micron commits more than $250 billion to US DRAM manufacturing through 2035, SK hynix's $26.5 billion Nasdaq listing prices and begins trading, and hyperscaler data center and interconnect infrastructure keeps expanding from Alberta to Google's dark fiber network.

Agentic AI Builds Out Across the Network: AI & Automation Insights, June 2026

Agentic AI Builds Out Across the Network: AI & Automation Insights, June 2026
June 2026 showed agentic AI scaling from pilot to platform: industry-wide standards momentum, AI-RAN field trials from Nokia, Amdocs and KDDI, and fresh capital across data centers on three continents. This full roundup covers every deployment, partnership, funding round and governance move from the month, with tools to prioritise AI use cases and plan the network around them.

Washington Takes a Stake in Intel as AI Infrastructure Heads to Orbit: Digital Infrastructure Insights, May 2026

Washington Takes a Stake in Intel as AI Infrastructure Heads to Orbit: Digital Infrastructure Insights, May 2026
May 2026's roundup: the US government's 10% equity stake in Intel (now valued above $50B) underscores how strategic chip manufacturing has become, India and Vietnam both advance new chip fab and testing capacity, the AI chip supply chain keeps fragmenting beyond Nvidia, and Pixxel and Sarvam AI plan India's first orbital data center satellite.

Samsung and Qualcomm Validate PC1 5G FWA on vRAN

Samsung and Qualcomm Validate PC1 5G FWA on vRAN
Samsung Electronics and Qualcomm Technologies have jointly validated Power Class 1 capability for 5G Fixed Wireless Access on a virtualized RAN architecture — a combination the industry has not demonstrated before. Testing showed up to ten times higher uplink throughput at the cell edge and up to 40% greater coverage range versus Power Class 1.5. With field trials already underway on a U.S. Tier-1 operator network and commercial availability targeted for 2027, this milestone signals a meaningful shift in uplink performance, coverage economics, and vRAN capability for operators and enterprise buyers alike.

Bosch and Qualcomm Advance ADAS with Snapdragon AI

Bosch and Qualcomm Advance ADAS with Snapdragon AI
Bosch and Qualcomm are extending their in-vehicle compute collaboration from digital cockpits into advanced driver-assistance systems, signaling a tighter convergence of safety, user experience, and centralized vehicle compute. Automakers are accelerating the shift from fragmented electronic control units to zonal and centralized architectures that run on fewer, more powerful processors. This deal aligns Bosch’s experience integrating automotive-grade compute with Qualcomm’s Snapdragon platforms to create scalable ADAS solutions that can be deployed across mainstream and premium vehicles. As software-defined vehicle strategies mature, consolidating safety, perception, and cockpit functions on shared compute is a pragmatic step to reduce cost and complexity.

MWC 2026 Keynote 6: Architects of the AI Age

MWC 2026 Keynotes
Live Streamed on Tues, 3 Mar at 09:30 - 11:00 CET

How will the AI systems we build today define technology, society, and humanity tomorrow? From advanced chip architectures and global networks to generative coding and the next frontier of digital identity, this session brings together pioneering leaders shaping both the systems, and the consequences of the AI world being built today.

Samsung 6G trial hits 3 Gbps at 7 GHz with X‑MIMO

Samsung 6G trial hits 3 Gbps at 7 GHz with X‑MIMO
Samsung Electronics, working with KT Corporation and Keysight Technologies, has demonstrated 3 Gbps peak downlink in outdoor tests using an ultra‑dense antenna system and X‑MIMO in the 7 GHz band. The field trial took place at Samsung’s Seoul R&D Campus and pushed eight concurrent spatial streams from a base station to a single user device. The key enabler was a radio unit that packs roughly four times the antenna elements of today’s 5G massive MIMO gear into a similar physical footprint. Shorter wavelengths at 7 GHz make that density feasible without expanding the radio size.
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