Qualcomm Unveils Wi-Fi 7 Innovations and IoT Platforms

Qualcomm Technologies recently announced the launch of innovative IoT platforms and the introduction of Wi-Fi 7 technology, aiming to enhance connectivity for mobile and industrial applications. Notable releases include the Qualcomm QCC730 and FastConnect 7900, demonstrating a significant step in evolving IoT and mobile connectivity solutions.
Qualcomm Unveils Wi-Fi 7 Innovations and IoT Platforms
Image Credit : Qualcomm | Qualcomm QCC730 Wi-Fi

Qualcomm Advances IoT and Mobile Connectivity with Innovative Platforms and Wi-Fi 7 Technology

At the Embedded World Exhibition & Conference and the Mobile World Congress, Qualcomm Technologies, Inc. has made significant strides in IoT and mobile connectivity. The company unveiled advanced IoT platforms, a groundbreaking micro-power Wi-Fi System on a Chip (SoC), and the pioneering Wi-Fi 7 chip for smartphones, marking its continuous leadership in driving digital transformation across industries.

Expanding IoT and Industrial Connectivity with Qualcomm


At Embedded World 2024, Qualcomm introduced the new Qualcommยฎ QCC730 Wi-Fi solution and Qualcommยฎ RB3 Gen 2 Platform. These enhancements are designed to empower customers in the IoT and embedded ecosystems, providing critical upgrades in on-device AI, high-performance, low-power processing, and connectivity.

The Qualcomm QCC730: Innovating IoT with Wi-Fi 7

The Qualcommยฎ QCC730 represents a major advancement in micro-power Wi-Fi technology for IoT connectivity. Offering up to 88% lower power consumption compared to previous generations, this SoC is a game-changer for battery-powered industrial, commercial, and consumer applications. It provides a high-performance alternative to Bluetoothยฎ for IoT applications requiring flexible design and direct cloud connectivity.

Expanding the RB3 Gen 2 Platform’s Capabilities

Utilizing the Qualcommยฎ QCS6490 processor, the RB3 Gen 2 Platform delivers a 10x increase in on-device AI processing, supports multiple high-resolution cameras, and includes integrated Wi-Fi 6E. This platform is suited for a wide range of applications, from industrial handheld devices to intelligent displays, and is now available for pre-order in development kits.

Qualcommโ€™s Industrial Grade Innovations

Qualcomm Technologies also announced plans to introduce an industrial-grade platform focused on meeting the stringent requirements of functional safety and environmental resilience in industrial applications. This platform, expected to be available in June 2024, will feature high-performance CPU, GPU, and on-device AI capabilities.

Foundries.io Acquisition to Boost Open Source Development

In a strategic move to enhance its software development capabilities, Qualcomm Technologies acquired Foundries.io, a leader in open-source cloud-native platforms. This acquisition will simplify the complexities of developing and updating Linux-based IoT and Edge devices, accelerating product commercialization.

FastConnect 7900: Leading the Way in Wi-Fi 7

At the Mobile World Congress, Qualcomm introduced the FastConnect 7900, its second-generation Wi-Fi 7 chip for smartphones, which is the industryโ€™s first to feature an on-chip AI engine. This chip optimizes connectivity experiences and delivers extreme power efficiency, crucial for enhancing smartphone battery life.

Advanced Connectivity and Proximity Features

The FastConnect 7900 integrates multiple technologies including Bluetooth Sounding, ultra-wideband (UWB), and IEEE 802.11az for proximity capabilities. It supports Multi-Link Operation (MLO), allowing devices to connect to multiple networks simultaneously, enhancing speed, reliability, and reducing latency.

Enhanced Audio Streaming and Proximity Interactions

This innovative chip also supports 24-bit, 192 kHz audio streaming over Wi-Fi, vastly improving the range and quality of wireless audio. Its proximity features through UWB and Bluetooth open up myriad use cases from secure car access to personal device interactions.

Revolutionary Size and Power Efficiency

The 6 nm FastConnect 7900 chip not only reduces power consumption by up to 50% compared to its predecessor but also features a smaller footprint, allowing for more compact smartphone designs.

Qualcommโ€™s Vision for Future Connectivity Solutions

Qualcomm Technologies continues to shape the future of connectivity with its robust portfolio of IoT and mobile technologies. By fostering innovations like the QCC730 and FastConnect 7900, Qualcomm underscores its commitment to enhancing connectivity solutions across the spectrum of consumer, commercial, and industrial applications.

For more detailed information about Qualcomm Technologies’ latest advancements, visit their website or explore their products at Booth #161, Hall 5, at NurnbergMesse.


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