Semiconductor

Semiconductors are the chips that make networks and devices work — from radio and baseband processors to the AI accelerators increasingly central to both network equipment and connected devices. Chip capability sets the ceiling on what networks and devices can do, determining which frequencies, features, and AI workloads are possible. The sector sits at the intersection of telecom, AI, and geopolitics, with supply chains, manufacturing capacity, and export controls shaping the broader technology landscape. For operators, enterprises, and vendors, semiconductor trends influence device capability, equipment cost, and the pace of AI adoption across networks. This channel covers semiconductors as they relate to connectivity and AI — chipsets for networks and devices, AI accelerators, and the supply-chain and geopolitical dynamics around them — with analysis of how chip developments enable or constrain the technologies built on top of them.

Alibaba's Zhenwu M890 AI accelerator, developed by chip unit T-Head, delivers approximately three times the performance of its predecessor and features 144GB of on-chip memory purpose-built for agentic AI workloads. Backed by a $53 billion infrastructure commitment and a published roadmap extending to the J900 chip in 2028, Alibaba is building sovereign AI infrastructure from silicon to software. With over 560,000 chips shipped to 400-plus customers across 20 industries, this is a commercially validated platform — not a prototype — signaling a maturing Chinese AI hardware ecosystem.
Samsung Electronics is accelerating its U.S. foundry strategy with the Taylor plant set to begin operations, anchored by 2-nanometer AI chips for Tesla’s next-generation self-driving platforms. After breaking ground in late 2022 with an initial $17 billion investment, Samsung’s Taylor fab is now holding its equipment installation ceremony and transitioning from build-out to run-up. For the U.S. semiconductor base, Taylor represents an advanced-node capacity point that complements Samsung’s existing Austin operations and expands domestic options beyond a single supplier. Tesla’s AI5 design has taped out, signaling it is ready for volume manufacturing, with AI6 following closely and expected to incorporate low-power DDR (LPDDR) memory to meet stringent automotive power budgets.
Deutsche Telekom’s launch of seamless IoT roaming across terrestrial, GEO, and LEO networks signals a practical turning point for standards‑based satellite IoT at global scale. Multi‑orbit roaming blends the strengths of geostationary (always‑on footprint, predictable links) with low‑earth orbit (lower latency, better high‑latitude reach) and terrestrial cellular to keep devices online where traditional networks fall short. The service has been validated on Nordic Semiconductor’s nRF9151—billed as the first 3GPP‑compliant cellular IoT module to support terrestrial NB‑IoT/LTE‑M and NB‑NTN over both GEO and LEO—which matters for total cost of ownership and speed to scale.
The plan centers on Visakhapatnam, a port city on India’s east coast, as a tightly coupled zone for data centers, subsea cable landings, power, water, and the digital supply chain. State leadership wants the cluster to be more than rack space. It aims to bring in server assemblers, power and cooling vendors, and specialized logistics to create end-to-end capability. The city is also being pitched as a landing point for new subsea systems toward Singapore, which would diversify India’s international connectivity beyond Chennai and Mumbai and lower latency into Southeast Asia.
Imec is scaling its R&D footprint and inaugurating a NanoIC pilot line to accelerate sub‑2nm and 3D system innovation under a roughly €2.5 billion European semiconductor push. Imec, the Leuven-based semiconductor research hub, is expanding lab capacity and bringing a new NanoIC pilot line online to speed learning cycles for logic beyond 2nm and advanced 3D integration. The goal is clear: shorten the path from materials and device research to system‑level demonstrators that de-risk future foundry nodes and packaging flows. For vendors and operators, this is about getting sooner access to manufacturable building blocks—ultra‑efficient logic tiles, memory stacks, and optical I/O—that cut TCO and footprint across networks and data centers.
An AI‑fueled land grab for advanced memory is squeezing supply for handsets, undercutting Qualcomm’s near‑term outlook even as end‑demand for premium Android devices improves. Memory suppliers are prioritizing high‑bandwidth memory (HBM) and DDR5 for AI accelerators and data center servers, diverting wafer capacity and capex away from mobile‑grade LPDDR5/5X and UFS storage. The result is a classic allocation cycle: supply chases the highest‑margin demand (HBM and enterprise SSDs), while downstream categories like smartphones and some edge devices face tighter availability and rising component costs. For Qualcomm, whose Snapdragon platforms anchor premium Android devices, the constraint limits upside volume and mix in the near term.
New Delhi has unveiled a sweeping tax holiday to capture the next wave of AI and cloud build-outs, positioning India as a long-term base for exporting compute. Foreign providers that deliver cloud and data center services to customers outside India will pay zero corporate tax on those revenues through 2047, provided workloads run from facilities in India. The budget also introduces a 15% cost-plus safe harbor for Indian data center units serving related foreign parties, simplifying transfer pricing for global delivery hubs. For cloud providers, it strengthens the business case to place GPU clusters, storage, and interconnect in India to serve overseas demand, not just local workloads.
The article examines:
The energy and thermal implications of rising compute density in data centers, Limitations of traditional air-based cooling at high rack power,
How direct-to-chip and immersion liquid cooling technologies improve heat transfer and energy performance,
Market, operational, and sustainability drivers influencing adoption in modern compute environments,
Broader implications for system architecture, infrastructure design, and future research directions.

Written as an objective, insight-led analysis rather than promotional content, the piece is designed to engage IEEE’s audience of computing researchers, systems engineers, and infrastructure strategists who are exploring how emerging cooling solutions intersect with future computing platforms and energy-aware design. The article is original and unpublished, and I’m happy to work with your editorial team to tailor it to IEEE Computer’s style and technical depth.
2025 has seen major telecom and tech M&A activity, including billion-dollar deals in fiber, AI, cloud, and cybersecurity. This monthly tracker details key acquisitions, like AT&T buying Lumen’s fiber assets and Google’s $32B move for Wiz, highlighting how consolidation is shaping the competitive landscape.
The administration plans an executive order to set a single national AI rulebook and override state-level frameworks, a move with immediate implications for telecom, cloud, and enterprise AI strategies. President Trump signaled he will sign an executive order establishing a uniform federal approach to AI governance that preempts state regulations. Reports indicate the order aims to reduce compliance friction by replacing diverse state rules with a lighter-touch national framework focused on competitiveness. State officials from both parties, safety advocates, and labor groups are preparing to fight the order, citing risks related to consumer harm, deepfakes, hiring bias, and child safety. On the other side, Silicon Valley leaders warn that 50-state compliance regimes could deter innovation and blunt national competitiveness.
Nokia is making a multi‑year, $4 billion push to expand US R&D and manufacturing as it pivots to AI‑native networks under CEO Justin Hotard. The company will invest roughly $3.5 billion in US‑based R&D spanning networking technologies, defense applications, automation, quantum‑safe networking, and semiconductor development. A further $500 million targets manufacturing and R&D expansion in Texas, New Jersey, and Pennsylvania, strengthening domestic supply chains for critical telecom gear. The plan follows Nokia’s strategy revamp and creation of a Mobile Infrastructure unit to advance an AI‑native network portfolio across RAN, transport, IP, and cloud.

Frequently Asked Questions

Why do telecom networks and devices depend so heavily on semiconductor advances?
Every part of the network, from smartphone modems to base station radios to data center servers running virtualized network functions, runs on chips, meaning advances or limitations in semiconductor technology directly determine what’s actually possible for network and device performance, energy efficiency, and cost. Faster, more efficient, and more specialized semiconductors translate directly into faster networks, longer device battery life, and lower operating costs for network infrastructure, while semiconductor limitations or supply constraints can directly slow down how quickly new network capabilities can actually reach commercial deployment. This deep dependency means semiconductor industry trends, often discussed as a somewhat separate topic, actually have direct, practical consequences for telecom network and device roadmaps.
What’s a 5G modem, and why does it matter which one a device uses?
A 5G modem is the specific chip responsible for handling a device’s cellular connection, managing tasks like connecting to available cell towers, processing the radio signal, and supporting whatever specific 5G features and frequency bands that particular chip was designed to handle. Different modems support different frequency bands, speeds, and power efficiency levels, which is why two phones with similar overall specifications can have meaningfully different real-world 5G performance, since the underlying modem chip’s capabilities determine what network features a device can actually access. Major modem chip manufacturers, including Qualcomm and MediaTek, compete heavily on these technical capabilities, releasing new modem generations somewhat ahead of when those features become broadly necessary.
How is AI demand affecting the semiconductor supply chain telecom relies on?
Surging demand for AI-capable chips, especially GPUs used for AI training and inference, is competing for the same manufacturing capacity and supply chains that produce networking and telecom semiconductors, creating pricing and availability pressure across the broader chip industry that indirectly affects telecom equipment and device costs. Semiconductor manufacturing capacity, particularly for the most advanced fabrication processes, is concentrated among a relatively small number of manufacturers globally, meaning a surge in demand from one major sector, like AI data center buildouts, can create ripple effects on availability and pricing for other sectors, including telecom, that rely on similar manufacturing capacity. This dynamic has become a meaningful factor in telecom equipment cost planning as AI infrastructure investment has accelerated.
Why are governments increasingly involved in semiconductor policy related to telecom?
Chips are considered critical infrastructure given their role in both networks and devices, leading governments to fund domestic semiconductor manufacturing and restrict certain chip exports, partly to reduce reliance on a small number of overseas suppliers and partly over genuine national security concerns about dependence on potentially adversarial countries for critical technology components. This has direct telecom relevance, since policies aimed at semiconductor supply chain security can affect the cost, availability, and sourcing options for the chips telecom equipment and device manufacturers rely on. Government semiconductor policy and telecom policy, like Open RAN supply chain diversification efforts, increasingly overlap, both driven by similar concerns about reducing dependence on a small number of geopolitically sensitive suppliers.
What’s the difference between a general-purpose chip and a specialized telecom chip?
A general-purpose chip, like a standard computer processor, is designed to handle a wide range of different computing tasks reasonably well, without being specifically optimized for any single function. A specialized telecom chip, by contrast, is purpose-built for a specific function within the network, like processing radio signals for a particular frequency band, or handling the specific calculations needed for massive MIMO antenna systems, and is typically far more efficient at that specific task than a general-purpose chip would be, though less flexible for other purposes. Telecom equipment generally uses a combination of both: specialized chips for performance-critical functions, and increasingly, general-purpose server processors for flexible, software-defined network functions running in virtualized infrastructure.
How do chip shortages or supply chain disruptions actually affect telecom companies?
Chip shortages or supply chain disruptions can directly delay telecom equipment manufacturing and device production, since both network infrastructure equipment and consumer devices depend on a steady, reliable supply of specific semiconductor components. During the broader global chip shortage of the early 2020s, several telecom equipment vendors and device manufacturers publicly reported delays in fulfilling orders, directly tracing back to semiconductor component availability issues. These disruptions also tend to affect smaller, newer market entrants disproportionately compared to large, established vendors with stronger existing relationships and contractual priority with chip manufacturers, since manufacturers facing constrained capacity often prioritize fulfilling orders for their largest, longest-standing customers first.
What role do GPUs specifically play in telecom infrastructure, beyond just AI?
Beyond their well-known role in AI training and inference, GPUs, or graphics processing units, are increasingly used in telecom infrastructure for tasks that benefit from their ability to perform many calculations simultaneously, known as parallel processing, including certain signal processing tasks within virtualized radio access network functions and accelerating specific network functions that would otherwise run more slowly on general-purpose server processors alone. As telecom infrastructure shifts toward AI-native telco cloud platforms specifically designed to run both traditional network functions and AI workloads on shared infrastructure, GPUs have become an increasingly central, rather than purely AI-specific, component of how that infrastructure is actually built.
How does semiconductor miniaturization relate to 5G and future 6G performance?
Semiconductor miniaturization, the ongoing process of fitting more transistors into a smaller physical chip area, has historically been a major driver of improved chip performance and energy efficiency over time, and this trend directly enables more advanced network capabilities. Smaller, more efficient chips allow network equipment to handle more sophisticated signal processing, like the complex calculations required for massive MIMO antenna systems, within the same power and physical size constraints as earlier, less capable chips. As the industry looks toward 6G, which is expected to require even more sophisticated AI-native processing directly within network equipment, continued semiconductor miniaturization is widely viewed as a practical prerequisite for making those future capabilities economically and physically feasible to deploy at scale.
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