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Verizon Launches 6G Innovation Forum

Tech News & Insight
September 23, 2025
Hema Kadia

Verizon has launched a 6G Innovation Forum to accelerate research, trials, and standards alignment for the next generation of wireless. The forum convenes major RAN suppliers, including Ericsson, Samsung Electronics, and Nokia - alongside platform and device ecosystem players such as Meta and Qualcomm Technologies. The stated goal is an open, diversified, and resilient 6G ecosystem with global alignment from the outset. Verizon will back the forum with hands-on environments, starting with a dedicated 6G Lab in Los Angeles. Early priorities include testing new spectrum bands and bandwidths, and validating interoperability with mainstream standards bodies.

Private 5G Manufacturing Modernization in America

Tech News & Insight
September 18, 2025
Hema Kadia

Manufacturers and wireless providers are shifting 5G from promising pilots to scaled, revenue‑relevant deployments across American factories. A joint report from the National Association of Manufacturers (NAM) and CTIA underscores a clear inflection point: commercial 5G, industrial AI and edge computing are maturing together. With 3GPP Release 16/17 capabilities such as URLLC, time‑sensitive networking integration, network slicing and non‑public networks, 5G is increasingly able to support time‑critical control, quality inspection and safety systems at scale. Production use cases are expanding and delivering measurable benefits. The message is consistent: companies that operationalize 5G alongside AI and automation will capture disproportionate productivity and resiliency advantages.

5G, AI, AR, Automation, Network Slicing, Orchestration, Private Networks, Security
3GPP, America, CBRS, Devices, Ericsson, GDP, General Motors, Investment, Mobility, Policy, Private 5G, Samsung, Spectrum, Verizon
Manufacturing

Gartner Projects $1.5T AI Spend by 2025

Tech News & Insight
September 18, 2025
Hema Kadia

Gartner’s latest outlook points to global AI spend hitting roughly $1.5 trillion in 2025 and exceeding $2 trillion in 2026, signaling a multi-year investment cycle that will reshape infrastructure, devices, and networks. This is not a short-lived hype curve; it is a capital plan. Hyperscalers are pouring money into data centers built around AI-optimized servers and accelerators, while device makers push on-device AI into smartphones and PCs at scale. For telecom and enterprise IT leaders, the message is clear: capacity, latency, and data gravity will dictate where value lands. Spending is broad-based. AI services and software are growing fast, but the heavy lift is in hardware and cloud infrastructure.

5G, AI, Automation, Monetization, Orchestration, RAN, Security, Semiconductor
3GPP, AMD, Apple, AWS, Azure, Cisco, Data Center, Data Privacy, Devices, Ericsson, GenAI, Google, GPU, GSMA, Intel, Investment, MediaTek, Microsoft, Nokia, Nvidia, Oracle, Partnerships, Policy, Qualcomm, Samsung, Spectrum
Telecom

SK hynix HBM4: World’s first HBM4 chip

Tech News & Insight
September 15, 2025
Hema Kadia

SK hynix says it has completed development and readied mass production of HBM4, signaling a new performance and efficiency baseline for next‑generation AI accelerators and cloud infrastructure. HBM4 doubles per‑stack bandwidth versus the prior generation by moving to a 2,048‑bit I/O interface and pushing data rates beyond 10 Gbps per pin, exceeding the JEDEC baseline of 8 Gbps for this class of memory. The company also cites more than 40% improvement in power efficiency, a critical lever as AI clusters strain data center power envelopes. Taken together, SK hynix claims this can lift end‑to‑end AI service performance by up to roughly two‑thirds.

AI, Semiconductor, Sustainability
Data Center, Samsung, Signal, SK Hynix

SoftBank’s $2B Intel Bet: Semiconductor and U.S. Foundry Outlook

Tech News & Insight
August 20, 2025
Hema Kadia

SoftBank will invest $2 billion in Intel, taking roughly a 2% stake at $23 per share and becoming one of Intels largest shareholders. It is a financial vote of confidence in a company trying to reestablish process leadership, scale a foundry business, and convince marquee customers to commit to external wafer orders. SoftBank has been assembling an AI supply-chain franchise that spans IP, compute, and infrastructure. It owns Arm, agreed to acquire Arm server CPU designer Ampere Computing, injected massive capital into OpenAI, and aligned with Oracle under the Stargate hyperscale AI initiative backed by the current U.S. administration.

5G, Open RAN, Semiconductor
AMD, Data Center, Foxconn, Intel, Investment, Nvidia, OpenAI, Oracle, Policy, Samsung, Softbank, TSMC

CBRS Refarming: Why It Hurts Private Networks

Tech News & Insight
August 17, 2025
Hema Kadia

More than $14 billion has been invested across the CBRS stacklicenses, RAN, devices, infrastructure, sensors, and software. Over 420,000 CBRS radio nodes (CBSDs) are in service. The device ecosystem is broad: Apple and Samsung ship n48-capable handsets; industrial and FWA suppliers support n48 CPEs and routers; Ericsson, Nokia, Samsung, JMA Wireless and others provide radio and DAS. This is not a pilot; it is production infrastructure. Refarming would force replacement or retuning of hundreds of thousands of base stations and millions of end devices, plus upgrades to SAS integrations and enterprise control planes.

5G, 6G, Private Networks
America, Apple, Broadband, CBRS, Devices, Ericsson, FCC, Federated Wireless, JMA Wireless, Neutral Host, Nokia, OnGo, Policy, Private 5G, Samsung, Spectrum, WiFi
Education, Energy & Utilities, HealthCare, Smart Cities, Sports & Events Venue, Warehouse and Logistics

Intel Spins Off NEX Division Amid $2.9B Loss & AI Pivot

Tech News & Insight
July 28, 2025
Hema Kadia

Intel is spinning off its Network and Edge (NEX) division after posting a $2.9B loss, cutting 15% of its workforce, and pivoting to an AI-first strategy. The standalone NEX business will focus on networking and edge innovation, with Intel retaining an anchor investor role. The move underscores Intel’s restructuring to prioritize x86 and AI while seeking agility to compete with NVIDIA, AMD, and Broadcom in high-performance networking and 5G infrastructure.

5G, AI, Edge/MEC, Network Infrastructure, Open RAN, Semiconductor
GPU, Intel, Samsung, TMSC

Tesla & Samsung Ink $16.5B Deal to Build AI6 Chips

Tech News & Insight
July 28, 2025
Hema Kadia

Tesla and Samsung have forged a $16.5B partnership to manufacture AI6 (Hardware 6) chips at Samsung’s Texas fab. Designed as a unified AI hardware platform, these chips will power Tesla’s Full Self-Driving vehicles, Optimus humanoid robots, and AI training clusters. The deal strengthens Tesla’s AI roadmap while positioning Samsung as a key player in high-performance AI silicon and U.S. chip manufacturing.

Samsung Unveils Rugged Galaxy XCover7 Pro and Tab Active5 Pro for Field Teams

Tech News & Insight
April 15, 2025
Hema Kadia

Samsung has launched two new rugged devices—the Galaxy XCover7 Pro smartphone and the Tab Active5 Pro tablet—designed for high-intensity fieldwork in sectors like logistics, healthcare, and manufacturing. These devices offer military-grade durability, advanced 5G connectivity, and enterprise-ready security with Samsung Knox Vault. Features like hot-swappable batteries, gloved-touch sensitivity, and AI-powered tools enhance productivity and reliability in harsh environments.

AI, Devices
Devices, eSIM, Samsung, WiFi
Construction, HealthCare, Manufacturing, Public sector, Retail, Warehouse and Logistics

Samsung and KT Partner on 6G Research to Enhance Signal Quality

Tech News & Insight
April 1, 2025
Hema Kadia

Samsung Electronics and KT Corporation have entered a strategic partnership to develop 6G network technologies, focusing on improving signal quality and system performance. Their research prioritizes advanced antenna systems like X-MIMO and AI-driven wireless communication enhancements. The companies aim to tackle high-frequency signal loss in the 7 GHz band and improve network reliability through beamforming and multi-spatial transmission.

5G, 6G, AI
KT, Samsung, Spectrum

India’s Mobile Manufacturing Faces Challenges with Weak Demand

News
January 9, 2025
Hema Kadia

India’s ambition to become a global smartphone manufacturing leader faces hurdles as nearly half of its production capacity remains underutilized. Despite significant investments and the government’s PLI scheme, weak domestic and global demand has impacted production. Industry leaders like Foxconn and Tata Electronics continue to expand, while smaller manufacturers struggle. Experts predict recovery as global demand for smartphones and advanced technologies grows by 2025.

5G
Apple, Devices, Foxconn, India, LTE, Samsung

Private 5G/LTE and CBRS Networks in Action: Transforming Industries

Article & Insights
January 4, 2025
Hema Kadia

Private 5G/LTE and CBRS networks are revolutionizing industries by enabling smarter cities, safer workplaces, and more efficient factories. This edition celebrates award-winning deployments and insights from industry leaders who are driving digital transformation. Explore real-world examples of how these networks optimize manufacturing operations, enhance supply chain visibility, and promote sustainable practices, making grids resilient and industries future-ready.